Available Brands

Dielectric

Applications

  • DC Blocking
  • RF Bypass
  • Filtering
  • Tuning

Description

High Frequency SLC for RF & Millimeter wave applications, easily customized.
Benefits:

  • Gold metallization for wire bonding
  • Rugged construction
  • Custom sizes at commercial prices
  • Thin film Technology
  • ESD proof





Notes:
  • See Di-Cap® Termination Code Table for available lead configurations.
  • Lead material is 0.002" pure silver, (Ag). 0.002" ± .0005" thick.
  • Leads are attached with AuSn, 80%/20% eutectic alloy. Re-flow temperature is 280°C minimum.
  • Pure Gold, (Au) leads are available. Consult factory for details.
  • Chip dimensions per Di-Cap® dimensions table.
  • Custom lead dimensions are available. Consult factory for details.