Substrates

High-K Ceramic Substrates & Plates

High-K substrates are used for circuit miniaturization. DLI offers complete fabrication services!

Case Sizes and Tolerances

For custom sizes please contact the sales office.
 
Case Size (Inches)  
Length (Inches)
 
Width (Inches)
Tolerance
Plates (H)
±(Inches)
Substrates (S)
±(Inches)
10 1.000 1.000 Substrates Only .002
15 1.000 1.500 .050 .002
20 2.000 2.000 .050 .002
25 2.500 2.500 .050 .002
30 3.000 3.000 .050 .002
40 4.000 4.000 .050 .002
 

Material Specifications

 
Material Code
Relative ξr*
@ 5 GHz
TCC†Loss ppm/°C Coefficient of Tangent*
% Max
Thermal Thermal Expansion
ppm/°K
Conductivity W/m-°K
QZ 3.82 (@ 1MHz) Fused Quartz 0.0015 (@ 1MHz) 0.033 (@ 24 GHz) 0.55 1.28
AG 8.85 ± 0.35 (@ 1MHz) Aluminum Nitride 0.10 4.6 140-180
PI 9.9 ± 0.15 (@ 1MHz) Alumina 99.6% 0.01 6.5 - 7.5 27
PG 12.5 ± 0.5 P22 ± 30 0.02 7.6
AH 20 ± 0.5 P90 ± 20 0.02 9.6 1.56
NA 23 ± 1 N30 ± 15 0.03 10.1 1.56
CF 25 ± 2 0 ± 15 0.15 9.0 1.56
CD 38 ± 1 N20 ± 15 0.04 5.8 1.59
CG 67 ± 3 0 ±30 0.10 9.0 1.59
NR 152 ± 5 N1500 ± 500 0.06 10.0 2.72
*Unless otherwise specified K dielectric measurement at approximately 5 GHz. †For the temperature range -55 to 125°C.


Surface Finish

Code Roughness Ra Material Process
X >50 µ in. As-Fired
Y 20 µ in. Machined
Z <5 µ in. Polished
S Special - Drawing required.
 

Metallization

Code Description
X No Metallization
M 300 Angstroms TiW, 100 µ in. min. Au
N 300 Angstroms TiW, 50 µ in. min. NiV, 100 µ in. min. Au
P 75 µ in. min. Nickel, 100 µ in. min. Au
L Top 50 Ohms/sq. TaN, 300 Angstroms TiW, 100 µ in. min Au.
Bottom Side 300 Angstroms TiW, 100 µ in. min. Au
E Metallized and etched per Customer drawing
T 300 Angstroms min. TiW, 50 µ in. min. NiV, 300 µ in. min. Au-Sn
D SPECIAL, Customer Drawing Required.

Screening Options

Test Code Test/Inspection Sample Size Description
X Visual Mechanical 100% Verify that the required area is available and continuous (Broken corners allowable).
K Visual Mechanical 100% Verify that the required area is available and continuous (Broken corners allowable).
Kent Test 10% of lot K and Loss.
D Customer Defined   Customer Drawing Required!

Ordering information - Thin Film - High-K Ceramic Substrates & Plates

S 20 CG 250 D Z N X
Product Case Size Material Thickness Thickness Tolerance Surface Finish Metallization Test Level
S = Substrate
H = Plate
10
15
20
25
30
40
See material table above. 100 = .010”
155 = .0155”
250 = .025”
Thickness Code. A three digit code representing the thickness in mils. Examples: Code 100 = .010”,
Code 155 = .0155”, Code 250 = .025”
Please consult with an applications engineer for thicknesses < .010”
D = ±.0005
E = ±.001
Thickness Tolerance Codes
D = ± .0005 – Machined or Polished
E = ± .001 – Standard
X Y Z S
See table
above.
See table above. X K D
See test level definitions on page 5.