Design Guidelines: Gridlok
Gridlok© is a simple, yet highly effective backside metallization structure that provides increased surface area for both soldered and epoxy attachment processes. When standard attachment interfaces test at marginal values, Gridlok© will optimize device adhesion and pull and shear strengths in critical applications.
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Parameter
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Comments
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1/10 Substrate Thickness, not <002"
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X Dimension Grid Spacing C to C
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1/10 Die X Dimension
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Y Dimension Grid Spacing C to C
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1/10 Die Y Dimension
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Platform Height
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.0002" - .002"
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Note: The Gridlok© pattern is placed on top of the "B" side metal thickness required for the designed device performance. A metal pull back will be required for "B" side standard metal to facilitate die separation without metal burring.