Design Guidelines: High Conductivity Traces
Minimize DC Resistive Losses - Where resistive losses in high power systems is critical, Knowles Precision Devices can create thick conductor structures with thick Cu as the current carrying medium adjacent to the fine lines and spaces of traditional thin film. These Cu structures are most commonly capped with Ni and Au, enhancing both soldering and typical chip and wire applications.
High Q inductors - Using our in-house plating capability, we can provide selective conductor thicknesses. In microwave circuits with spiral inductors, a High-Q Inductor can be added by selectively plating the gold thickness as required by the design.
Conductor Sheet Resistivities
|
Cu
|
.002"
|
.21
|
|
Au
|
120u"
|
9-10
|
|
320u"
|
4-5
|
|
Typical
|
Minimal Line/Gap
|
Comments
|
|
Thickness
|
Tolerance±
|
Width
|
Tolerance±
|
|
.002"
|
20%
|
.003"
|
.0003"
|
Min thickness specifications are useful
here where an upper thickness limit is
not critical
|
|
.0001"
|
25%
|
.003"
|
.0003"
|
|
.000125"
|
20%
|
.003"
|
.0003"
|
|
20µ"
|
15µ"
|
.003"
|
.0003"
|
Must be isolated with NiOx dam
|
1. Common uses are; seal rings, solder launches and power distribution. These structures can be utilized alongside typical fine line microwave structures such as couplers, splitters, combiners and filters.
2. High conductivity structures in conjunction with solid copper filled vias can produce an hermetic feed through. Contact the factory for typical hermeticity results.